A thermoset bulk molding compound useful for making automotive components such as headlamps, as well as other articles of manufacture are described. The composition incorporates moisture absorbing components such as molecular sieves to absorb water present in the compound before molding, thus reducing or eliminating mold defects while retaining the physical properties needed for automotive applications. This results in an as-molded composition with a gloss measured at 60° of greater than 85 GU that can be, without the necessity of a base coat, metallized directly and have reflector quality and durability. The metallized molded components can undergo additional steps such as applying protective sealant layers, as required by the automotive application. The removal of water before molding and the direct metallization reduces the production time of the molded articles.