发明申请
US20180366421A1 ELECTRONIC DEVICE PACKAGES WITH CONFORMAL EMI SHIELDING AND RELATED METHODS
审中-公开
基本信息:
- 专利标题： ELECTRONIC DEVICE PACKAGES WITH CONFORMAL EMI SHIELDING AND RELATED METHODS
- 申请号：US15847193 申请日：2017-12-19
- 公开(公告)号：US20180366421A1 公开(公告)日：2018-12-20
- 发明人： Eric Li , Joshua Heppner , Rajendra Dias , Mitul Modi
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/60
- IPC分类号： H01L23/60 ; H01L21/78 ; H01L23/31 ; H01L21/56 ; H01L23/552 ; H01L23/00
摘要：
Electronic device package technology is disclosed. In one example, an electronic device package can include a bottom surface and a side surface extending from the bottom surface. The side surface can be oriented at a non-perpendicular angle relative to the bottom surface. In another example, an electronic device package can include a top planar surface having a first area, a bottom planar surface having a second area, and a side surface extending between the top surface and the bottom surface. The second area can be larger than the first area. In yet another example, an electronic device package can include a substrate defining a plane, an electronic component disposed on the substrate, and a layer of material disposed about a lateral side of the electronic component. The layer of material can be oriented at an angle of less than 90 degrees relative to the plane.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/552 | .防辐射保护装置，例如光 |
| ----------H01L23/60 | ..防静电荷或放电的保护装置，例如法拉第防护屏 |