
基本信息:
- 专利标题: PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
- 申请号:US14223938 申请日:2014-03-24
- 公开(公告)号:US20170309669A9 公开(公告)日:2017-10-26
- 发明人: Homayoon Haddad , Jutao Jiang , Jeffrey McKee , Drake Miller , Leonard Forbes , Chintamani Palsule
- 申请人: SiOnyx, LLC
- 申请人地址: US MA Beverly
- 专利权人: SiOnyx, Inc.
- 当前专利权人: SiOnyx, Inc.
- 当前专利权人地址: US MA Beverly
- 主分类号: H01L27/146
- IPC分类号: H01L27/146
摘要:
Photosensitive devices and associated methods are provided. In one aspect, for example, a photosensitive imager device can include a semiconductor substrate having multiple doped regions forming at least one junction, a textured region coupled to the semiconductor substrate and positioned to interact with electromagnetic radiation, and an electrical transfer element coupled to the semiconductor substrate and operable to transfer an electrical signal from the at least one junction. In one aspect, the textured region is operable to facilitate generation of an electrical signal from the detection of infrared electromagnetic radiation. In another aspect, interacting with electromagnetic radiation further includes increasing the semiconductor substrate's effective absorption wavelength as compared to a semiconductor substrate lacking a textured region.
公开/授权文献:
- US09911781B2 Photosensitive imaging devices and associated methods 公开/授权日:2018-03-06
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L27/00 | 由在一个共用衬底内或其上形成的多个半导体或其他固态组件组成的器件 |
--------H01L27/02 | .包括有专门适用于整流、振荡、放大或切换的半导体组件并且至少有一个电位跃变势垒或者表面势垒的;包括至少有一个跃变势垒或者表面势垒的无源集成电路单元的 |
----------H01L27/144 | ..由辐射控制的器件 |
------------H01L27/146 | ...图像结构 |