基本信息:
- 专利标题： METHOD FOR MANUFACTURING ELEMENT CHIP
- 申请号：US15426199 申请日：2017-02-07
- 公开(公告)号：US20170263500A1 公开(公告)日：2017-09-14
- 发明人： BUNZI MIZUNO , SHOGO OKITA , MITSURU HIROSHIMA , TUTOMU SAKURAI , NORIYUKI MATSUBARA
- 申请人： Panasonic Intellectual Property Management Co., Ltd.
- 优先权： JP2016-048002 20160311
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L21/67
摘要：
The method includes a laser scribing step of forming an opening including an exposing portion, where the first layer is exposed, by irradiating the dividing region of the substrate with laser light from the first main surface side, forming a remaining region on which the second layer in the dividing region remains around the opening other than the exposing portion, and forming a first damaged region of a surface layer portion of the first layer including the exposing portion and a second damaged region of a surface layer portion of the first layer to be covered by the remaining region on the first layer of the dividing region.
公开/授权文献:
- US09941167B2 Method for manufacturing element chip 公开/授权日：2018-04-10
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
| ----------H01L21/71 | ..限定在组H01L21/70中的器件的特殊部件的制造 |
| ------------H01L21/78 | ...把衬底连续地分成多个独立的器件 |