基本信息:
- 专利标题： BALL GRID ARRAY SOLDER ATTACHMENT
- 申请号：US14974807 申请日：2015-12-18
- 公开(公告)号：US20170179069A1 公开(公告)日：2017-06-22
- 发明人： Jonathon R. Carstens , Michael S. Brazel , Russell S. Aoki , Laura S. Mortimer
- 申请人： Jonathon R. Carstens , Michael S. Brazel , Russell S. Aoki , Laura S. Mortimer
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; B23K3/06 ; B23K1/00 ; B23K3/08 ; H01L23/498 ; H01L23/34
摘要：
Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |