基本信息:
- 专利标题： ELECTRONIC COMPONENT PACKAGE
- 申请号：US15205483 申请日：2016-07-08
- 公开(公告)号：US20170178992A1 公开(公告)日：2017-06-22
- 发明人： Sung Won JEONG , Ji Hoon KIM , Sun Ho KIM , Shang Hoon SEO , Seung Yeop KOOK , Christian ROMERO
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2015-0183138 20151221
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/00 ; H01L23/48
摘要：
An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a component disposition region defined by an inner wall of the frame surrounding the electronic component, and an encapsulant filling at least a portion of the component disposition region. A portion of the inner wall of the frame forms a protrusion protruding toward the electronic component.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/02 | .容器；封接 |
| ----------H01L23/31 | ..按配置特点进行区分的 |