基本信息:
- 专利标题： DUAL TEMPERATURE HEATER
- 专利标题（中）：双温加热器
- 申请号：US14875392 申请日：2015-10-05
- 公开(公告)号：US20160093521A1 公开(公告)日：2016-03-31
- 发明人： Dale R. DU BOIS , Juan Carlos ROCHA-ALVAREZ , Sanjeev BALUJA , Ganesh BALASUBRAMANIAN , Lipyeow YAP , Jianhua ZHOU , Thomas NOWAK
- 申请人： Applied Materials, Inc.
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; H01L21/67 ; H01L21/324 ; H01L21/687
摘要：
A method and apparatus for heating a substrate in a chamber are provided. an apparatus for positioning a substrate in a processing chamber. In one embodiment, the apparatus comprises a substrate support assembly having a support surface adapted to receive the substrate and a plurality of centering members for supporting the substrate at a distance parallel to the support surface and for centering the substrate relative to a reference axis substantially perpendicular to the support surface. The plurality of the centering members are movably disposed along a periphery of the support surface, and each of the plurality of centering members comprises a first end portion for either contacting or supporting a peripheral edge of the substrate.
摘要（中）：
提供了一种用于加热室中的衬底的方法和装置。 用于将基板定位在处理室中的装置。 在一个实施例中，该装置包括基板支撑组件，该基板支撑组件具有适于接收基板的支撑表面和用于在平行于支撑表面的距离处支撑基板的多个定心构件，并且用于使基板相对于参考轴线基本垂直 到支撑面。 多个定心构件沿着支撑表面的周边可移动地设置，并且多个定心构件中的每一个包括用于接触或支撑衬底的周缘的第一端部。
公开/授权文献:
- US10325799B2 Dual temperature heater 公开/授权日：2019-06-18