基本信息:
- 专利标题： CURABLE COMPOSITION
- 申请号：US13935857 申请日：2013-07-05
- 公开(公告)号：US20130293808A1 公开(公告)日：2013-11-07
- 发明人： Bum Gyu CHOI , Min Jin KO , Myung Sun MOON , Jae Ho JUNG , Dae Ho KANG , Min Kyoun KIM , Byung Kyu CHO
- 申请人： LG CHEM, LTD.
- 优先权： KR10-2011-0001457 20110106; KR10-2012-0002157 20120106
- 主分类号： H01L33/52
- IPC分类号： H01L33/52 ; G02F1/1335 ; H01L23/29
摘要：
A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
公开/授权文献:
- US08916653B2 Curable composition 公开/授权日：2014-12-23