基本信息:
- 专利标题： SPUTTERING TARGET-BACKING PLATE ASSEMBLY
- 专利标题（中）：喷射目标板组件
- 申请号：US13579606 申请日：2011-02-16
- 公开(公告)号：US20120318669A1 公开(公告)日：2012-12-20
- 发明人： Yuki Ikeda , Yuichiro Nakamura , Atsutoshi Arakawa
- 申请人： Yuki Ikeda , Yuichiro Nakamura , Atsutoshi Arakawa
- 申请人地址： JP Tokyo
- 专利权人： JX NIPPON MINING & METALS CORPORATION
- 当前专利权人： JX NIPPON MINING & METALS CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-035282 20100219
- 国际申请： PCT/JP2011/053211 WO 20110216
- 主分类号： C23C14/06
- IPC分类号： C23C14/06 ; B05D5/12 ; B32B15/04 ; C23C14/08
摘要：
Provided is a sputtering target-backing plate assembly where a raw material powder prepared so as to have the composition of a magnetic material sputtering target is filled in a die together with a backing plate and hot-pressed, thereby being bonded to the backing plate simultaneously with sintering of the magnetic material target powder.It is an object of the present invention to provide a sputtering target-backing plate assembly having a high average pass through flux and allowing more stable sputtering, by disposing the raw material powder for a target on the backing plate and sintering them.By simultaneously performing sintering and bonding, a sputtering target-backing plate assembly has a shorter manufacturing process, can shorten manufacturing period, and does not cause a problem of detachment due to an increase in temperature during sputtering. In addition, it is also an object of the present invention to provide a sputtering target-backing plate assembly at a reduced cost and with an improved average pass through flux (PTF).
摘要（中）：
提供了一种溅射靶 - 背板组件，其中将具有磁性材料溅射靶的组成的原料粉末与背板一起填充在模具中并进行热压，从而同时粘合到背板上 通过烧结磁性材料目标粉末。 本发明的目的是提供一种具有高平均通过焊剂的溅射靶 - 背板组件，通过将用于靶材的原料粉末设置在背板上并进行烧结来提供更稳定的溅射。 通过同时进行烧结和接合，溅射靶 - 背板组件具有较短的制造工艺，可以缩短制造周期，并且不会由于溅射期间的温度升高而引起分离的问题。 此外，本发明的另一个目的是以降低的成本提供溅射靶 - 背板组件，并且具有改进的平均通过焊剂（PTF）。