发明申请
US20100200946A1 Method for forming trench isolation using a gas cluster ion beam growth process
有权
![Method for forming trench isolation using a gas cluster ion beam growth process](/abs-image/US/2010/08/12/US20100200946A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: Method for forming trench isolation using a gas cluster ion beam growth process
- 专利标题(中):使用气体团簇离子束生长过程形成沟槽隔离的方法
- 申请号:US12367697 申请日:2009-02-09
- 公开(公告)号:US20100200946A1 公开(公告)日:2010-08-12
- 发明人: John J. Hautala
- 申请人: John J. Hautala
- 申请人地址: US MA Billerica
- 专利权人: Tel Epion Inc.
- 当前专利权人: Tel Epion Inc.
- 当前专利权人地址: US MA Billerica
- 主分类号: H01L27/04
- IPC分类号: H01L27/04 ; H01L21/762
摘要:
A method of forming shallow trench isolation on a substrate using a gas cluster ion beam (GCIB) is described. The method comprises generating a GCIB, and irradiating the substrate with the GCIB to form a shallow trench isolation structure by growing a dielectric layer in at least one region on the substrate.
摘要(中):
描述了使用气体簇离子束(GCIB)在衬底上形成浅沟槽隔离的方法。 该方法包括生成GCIB,并且通过在衬底上的至少一个区域中生长介电层,通过GCIB照射衬底以形成浅沟槽隔离结构。