The peeling-off of a deposited film caused by a carrier is restrained, and the exchange period of the carrier is prolonged. In a carrier 1 including a slider 7 having a mechanism for conveying a substrate holder 3 that supports a substrate 2, a deposition shield 20a, 20b that can cover the substrate holder 3 and has an opening equivalent to or larger than the substrate 2 on which a film is formed is installed on both surfaces of the substrate holder 3. At this time, the substrate holder 3, supporting claws 4, and fixing parts 6 are arranged so as to be hidden by the deposition shield 20. In a film forming chamber, to form a predetermined film on the substrate 2, the carrier 1 covered by the deposition shield 20 is exposed to a plasma space in the film forming chamber, and the film is formed. The deposition of film onto the substrate holder 3, the supporting claws 4, and the fixing parts 6 that are covered by the deposition shield 20 can be restrained. Therefore, the peeling-off of film due to the deflection of claw or the peeling-off of film from the acute angle part of the fixing part 6 and the like is restrained, by which the exchange period of the carrier 1 can be prolonged.