发明申请
US20050012140A1 EEPROM device having selecting transistors and method of fabricating the same
有权
![EEPROM device having selecting transistors and method of fabricating the same](/abs-image/US/2005/01/20/US20050012140A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: EEPROM device having selecting transistors and method of fabricating the same
- 专利标题(中):具有选择晶体管的EEPROM器件及其制造方法
- 申请号:US10891803 申请日:2004-07-14
- 公开(公告)号:US20050012140A1 公开(公告)日:2005-01-20
- 发明人: Kwang-Shik Shin , Han-Soo Kim , Sung-Hoi Hur
- 申请人: Kwang-Shik Shin , Han-Soo Kim , Sung-Hoi Hur
- 优先权: KR2003-47972 20030714
- 主分类号: H01L21/8247
- IPC分类号: H01L21/8247 ; G11C11/34 ; H01L27/10 ; H01L27/115 ; H01L29/788 ; H01L29/792
摘要:
An EEPROM includes a device isolation layer for defining a plurality of active regions, a pair of control gates extending across the active regions and a pair of selection gates patterns that extend across the active regions and are interposed between the control gate patterns. A floating gate pattern is formed on intersection regions where the control gate patterns extend across the active regions. A lower gate pattern is formed on intersection regions where the selection gate patterns extend across the active regions. An inter-gate dielectric pattern is disposed between the control gate pattern and the floating gate pattern and a dummy dielectric pattern is disposed between the selection gate pattern and the lower gate pattern. The dummy dielectric pattern is substantially parallel to the selection gate pattern, and self-aligned with one sidewall of the selection gate pattern to overlap a predetermine width of the selection gate pattern.
摘要(中):
EEPROM包括用于限定多个有源区的器件隔离层,跨越有源区延伸的一对控制栅极和跨越有源区延伸并插入在控制栅极图案之间的一对选择栅极图案。 浮动栅极图案形成在跨越有源区域的控制栅极图案延伸的交叉区域上。 在选择栅极图案跨越有源区域延伸的交叉区域上形成下部栅极图案。 栅极间电介质图案设置在控制栅极图案和浮置栅极图案之间,并且虚设电介质图案设置在选择栅极图案和下部栅极图案之间。 虚拟介质图案基本上平行于选择栅极图案,并且与选择栅极图案的一个侧壁自对准以重叠选择栅极图案的预定宽度。
公开/授权文献:
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置;专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
----------H01L21/71 | ..限定在组H01L21/70中的器件的特殊部件的制造 |
------------H01L21/78 | ...把衬底连续地分成多个独立的器件 |
--------------H01L21/782 | ....制造多个器件,每一个由单个电路元件组成 |
----------------H01L21/822 | .....衬底是采用硅工艺的半导体的 |
------------------H01L21/8222 | ......双极工艺 |
--------------------H01L21/8234 | .......MIS工艺 |
----------------------H01L21/8239 | ........存储器结构 |
------------------------H01L21/8246 | .........只读存储器结构(ROM) |
--------------------------H01L21/8247 | ..........电可编程序的 |