发明申请
US20040262757A1 Semiconductor device, ball grid array connection system, and method of making
有权
基本信息:
- 专利标题： Semiconductor device, ball grid array connection system, and method of making
- 专利标题（中）：半导体器件，球栅阵列连接系统及制作方法
- 申请号：US10890184 申请日：2004-07-14
- 公开(公告)号：US20040262757A1 公开(公告)日：2004-12-30
- 发明人： Larry D. Kinsman , Salman Akram
- 主分类号： H01L021/48
- IPC分类号： H01L021/48 ; H01L029/40
摘要：
A semiconductor device is provided with a metal stiffening layer between the die and a multilayer structure comprising at least two insulating layers each having at least one conductor thereon. A top insulating layer of the multilayer structure contains a ball grid array. The metal layer is used as an electrical ground plane to simplify the routing pattern of conductive traces on the insulating material. The metal layer may also be used to dissipate heat from the die. The conductors of the multilayer structure provide additional versatility in wiring the die to the ball grid array.