基本信息:
- 专利标题： Small and securely-soldered electronic unit
- 专利标题（中）：小而安全焊接的电子单元
- 申请号：US10699476 申请日：2003-10-31
- 公开(公告)号：US20040090755A1 公开(公告)日：2004-05-13
- 发明人： Hiroyuki Yatsu
- 申请人： Alps Electric Co., Ltd.
- 申请人地址： null
- 专利权人： Alps Electric Co., Ltd.
- 当前专利权人： Alps Electric Co., Ltd.
- 当前专利权人地址： null
- 优先权： JPU2002-006978 20021101
- 主分类号： H05K007/02
- IPC分类号： H05K007/02 ; H05K007/06 ; H05K007/08 ; H05K007/10
摘要：
An electronic unit includes a module in which a semiconductor device is attached on the bottom of a circuit board and which has lands provided on the bottom of the circuit board, and a printed circuit board on which the module is mounted, the printed circuit board having a hole in a position facing the semiconductor device and having electrical conductors to which the lands are soldered. The module is mounted on the printed circuit board by soldering the lands to the electrical conductors while the semiconductor device is disposed in the hole. Accordingly, the electronic unit is smaller in height than conventional electronic units. Such a structure allows the module to be surface-mounted on the printed circuit board with solder paste, and thus high productivity of the electronic unit can be achieved.
摘要（中）：
电子单元包括其中半导体器件安装在电路板的底部并且具有设置在电路板的底部上的焊盘的模块和安装模块的印刷电路板，印刷电路板具有 位于面向半导体器件的位置的孔，并且具有焊盘焊接到其上的电导体。 当半导体器件设置在孔中时，通过将焊盘焊接到电导体上来将模块安装在印刷电路板上。 因此，电子单元的高度比常规电子单元小。 这种结构允许模块用焊膏表面安装在印刷电路板上，从而可以实现电子单元的高生产率。