基本信息:
- 专利标题： 發光模組 LIGHT EMITTING MODULE
- 专利标题（英）：Light emitting module
- 专利标题（中）：发光模块 LIGHT EMITTING MODULE
- 申请号：TW092109895 申请日：2003-04-28
- 公开(公告)号：TWI266432B 公开(公告)日：2006-11-11
- 发明人： 幕田功 ISAO MAKUTA
- 申请人： 歐姆龍股份有限公司 OMRON CORPORATION
- 申请人地址： 日本
- 专利权人： 歐姆龍股份有限公司 OMRON CORPORATION
- 当前专利权人： 歐姆龍股份有限公司 OMRON CORPORATION
- 当前专利权人地址： 日本
- 代理人： 何金塗; 何秋遠
- 优先权： 日本 2002-128412 20020430
- 主分类号： H01L
- IPC分类号： H01L
將一對陸地33、34在配線基板24之表面相對，分別連接陸地33、34在2條配線線路35、36。發光零件23之組裝側外部電極30連接於作晶粒接合的導線架，非組裝側外部電極31藉由接合線連接在結合於發光元件的導線架。然後，將組裝側外部電極30以軟焊料37接合於陸地33，非組裝側外部電極31以軟焊料37接合於陸地34，組裝發光零件23在配線基板24之上。並使軟焊有發光零件23之組裝側外部電極30側的配線線路35線路寬，作成大於軟焊有非組裝側外部電極31側的配線線路26之線路寬。
The present invention is to provide a light emitting module which is simply composed, and which does not cause too large thickness and size, so as to make heat dissipation of light emitting components good. A pair of lands 33, 34 which are in respect to a surface of a wiring substrate 24, are respectively connected to two wiring circuit 35, 36. An assembly side outer electrode 30 of the Light emitting component 23 is connected to a lead frame which is used to mount a chip, on the contrary, a non-assembly side outer electrode 31 is connected the lead frame of the light emitting component through wiring bonding. And then the assembly side outer electrode 30 is connected to connected to the land 33 through soft solder paste 37, the non-assembly side outer electrode 31 is connected the land 34 through soft solder paste 37, an assembly light emitting component 23 is arranged on the wiring substrate 24. Width of a wiring circuit 35 which is soft soldered with the light emitting component 23, is wider than that of the wiring circuit 36 which is soft soldered with the non-assembly side outer electrode 31.
公开/授权文献:
- TW200308106A 發光模組 LIGHT EMITTING MODULE 公开/授权日：2003-12-16