基本信息:
- 专利标题： 用於檢測晶圓上缺陷之系統
- 专利标题（英）：System for detecting defects on a wafer
- 专利标题（中）：用于检测晶圆上缺陷之系统
- 申请号：TW106133889 申请日：2014-02-05
- 公开(公告)号：TW201802770A 公开(公告)日：2018-01-16
- 发明人： 吳肯翁 , WU,KENONG , 高理升 , GAO,LISHENG , 陳葛雷斯 秀-玲 , CHEN,GRACE HSIU-LING , 碩爾特大衛 W , SHORTT,DAVID W.
- 申请人： 克萊譚克公司 , KLA-TENCOR CORPORATION
- 专利权人： 克萊譚克公司,KLA-TENCOR CORPORATION
- 当前专利权人： 克萊譚克公司,KLA-TENCOR CORPORATION
- 代理人： 陳長文
- 优先权： 61/759,949 20130201;61/913,379 20131208;14/169,161 20140131
- 主分类号： G06T7/00
- IPC分类号： G06T7/00
Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.
公开/授权文献:
- TWI614722B 用於檢測晶圓上缺陷之系統 公开/授权日：2018-02-11
信息查询:
EspacenetIPC结构图谱:
| G | 物理 |
| --G06 | 计算；推算；计数 |
| ----G06T | 一般的图像数据处理或产生 |
| ------G06T7/00 | 图像分析，例如从位像到非位像 |