基本信息:
- 专利标题： 麥克風裝置
- 专利标题（英）：Microphone device
- 专利标题（中）：麦克风设备
- 申请号：TW103122906 申请日：2014-07-02
- 公开(公告)号：TW201603592A 公开(公告)日：2016-01-16
- 发明人： 王傳蔚 , WANG, CHUAN WEI
- 申请人： 晶鎂電子股份有限公司 , 3R SEMICONDUCTOR TECHNOLOGY INC.
- 申请人地址： 新竹市
- 专利权人： 晶鎂電子股份有限公司,3R SEMICONDUCTOR TECHNOLOGY INC.
- 当前专利权人： 晶鎂電子股份有限公司,3R SEMICONDUCTOR TECHNOLOGY INC.
- 当前专利权人地址： 新竹市
- 代理人： 吳豐任; 李俊陞; 戴俊彥
- 主分类号： H04R17/02
- IPC分类号： H04R17/02
A microphone device includes a carrier board, a micro electro mechanical system unit, an integrated circuit and an upper cover. The micro electro mechanical system unit includes a substrate, a cap and a capacitive microphone. The cap is installed on the substrate, and is composed of electrically conductive material. The capacitive microphone is positioned between the cap and the carrier board, wherein the capacitive microphone and the cover form a resonant cavity. The integrated circuit is installed on the carrier board, and arranged to control the capacitive microphone. The upper cover is connected to the carrier board, wherein the micro electro mechanical system unit and the integrated circuit are both positioned inside a space formed by the carrier board and the upper cover.
公开/授权文献:
- TWI547180B 麥克風裝置 公开/授权日：2016-08-21
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H04 | 电通信技术 |
| ----H04R | 扬声器、送话器、唱机拾音器或类似的传感器 |
| ------H04R17/00 | 压电传感器；电致伸缩传感器 |
| --------H04R17/02 | .传声器 |