One of the purposes of the present invention is to provide an silicone adhesive composition which comprises no antioxidant, has sufficient adhesive, tack properties and excellent heat resistance, and provides a silicone adhesive composition which has no adhesive residue in a test described below. The other purpose of the present invention is to provide an adhesive film and an adhesive tape having a cured layer obtained from the composition. The present invention provides an addition curable or peroxide curable silicone adhesive composition, wherein the addition curable silicone adhesive composition comprises (A1) a diorganopolysiloxane having an alkenyl group and a viscosity at 25 degrees C. of 100,000 mPas or more, (B) an organopolysiloxane having R13SiO0.5 units and SiO2 units, wherein R1 is a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) an organchydrogenpolysiloxane having at least three SiH groups, (D) optionally an addition reaction inhibitor, (E) a platinum group metal catalyst for an addition reaction, and (F) an organic solvent, and the peroxide curable silicone adhesive composition comprises (A2) a diorganopolysiloxane having a viscosity at 25 degrees C. of 100,000 mPas or more and may or may not have an alkenyl group, (B) an organopolysiloxane having R13SiO0.5 units and SiO2 units, wherein R1 is a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atom, (F) an organic solvent, and (G) an organic peroxide, and components (A1) and (A2) may be accompanied with octamethylcyclotetrasiloxane and/or decamethylcyclopentasiloxane and each content of octamethylcyclotetrasiloxane and decamethylcyclopentasiloxane is less than 0.1 mass %, based on a total amount of component (A1) or (A2), component (B) and octamethylcyclotetrasiloxane and decamethylcyclopentasiloxane.