基本信息:
- 专利标题： 熱傳導性接著片、其製造方法及使用此的電子裝置
- 专利标题（英）：Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same
- 专利标题（中）：热传导性接着片、其制造方法及使用此的电子设备
- 申请号：TW103133160 申请日：2014-09-25
- 公开(公告)号：TW201535807A 公开(公告)日：2015-09-16
- 发明人： 森田亘 , MORITA, WATARU , 加藤邦久 , KATO, KUNIHISA , 武藤豪志 , MUTOU, TSUYOSHI
- 申请人： 琳得科股份有限公司 , LINTEC CORPORATION
- 专利权人： 琳得科股份有限公司,LINTEC CORPORATION
- 当前专利权人： 琳得科股份有限公司,LINTEC CORPORATION
- 代理人： 洪澄文
- 优先权： 2013-198788 20130925
- 主分类号： H01L35/30
- IPC分类号： H01L35/30 ; C09J7/00 ; C09J9/00 ; C09J11/04 ; C09J175/04 ; C09J183/04 ; C09J201/00 ; H01L35/32 ; H01L35/34 ; H02N11/00
The purpose of the present invention is to provide: a heat-conductive adhesive sheet which can be stacked easily and without interposing an adhesive layer in an electronic device, and, additionally, can selectively radiate heat in a specific direction, and can impart a sufficient temperature difference to the interior of the electronic device; a manufacturing method for the same; and an electronic device using the same. The heat-conductive adhesive sheet comprises a high heat conductivity part and a low heat conductivity part, the high heat conductivity part and the low heat conductivity part have adhesive properties, and either: the high heat conductivity part and the low heat conductivity part each independently constitute the full thickness of the heat-conductive adhesive sheet; or the high heat conductivity part and/or the low heat conductivity part constitute a portion of the thickness of the heat-conductive adhesive sheet. A manufacturing method for the heat-conductive adhesive sheet and an electronic device using the heat-conductive adhesive sheet are also provided.
公开/授权文献:
- TWI676304B 熱傳導性接著片、其製造方法及使用此的電子裝置 公开/授权日：2019-11-01