基本信息:
- 专利标题： 表面處理銅箔、覆銅積層板、印刷配線板、電子機器及印刷配線板之製造方法
- 专利标题（英）：Treated surface copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method
- 专利标题（中）：表面处理铜箔、覆铜积层板、印刷配线板、电子机器及印刷配线板之制造方法
- 申请号：TW103143262 申请日：2014-12-10
- 公开(公告)号：TW201531172A 公开(公告)日：2015-08-01
- 发明人： 新井英太 , ARAI, HIDETA , 三木敦史 , MIKI, ATSUSHI , 新井康修 , ARAI, KOHSUKE , 中室嘉一郎 , NAKAMURO, KAICHIRO
- 申请人： JX日鑛日石金屬股份有限公司 , JX NIPPON MINING & METALS CORPORATION
- 专利权人： JX日鑛日石金屬股份有限公司,JX NIPPON MINING & METALS CORPORATION
- 当前专利权人： JX日鑛日石金屬股份有限公司,JX NIPPON MINING & METALS CORPORATION
- 代理人： 閻啟泰; 林景郁
- 优先权： JP2013-255464 20131210
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K3/46
Provided is a treated surface copper foil with excellent resin transparency after the copper foil has been removed by etching. For the treated surface copper foil, respective surface treatments have been performed on the two surfaces. After being bonded from one surface on both surfaces of a polyimide resin substrate, the copper foil on both surfaces is removed by etching. In the observation point-brightness graph obtained when a printed object on which a line-shaped mark has been printed is photographed, Sv as defined by equation (1) is at least 3.5. Sv = ([increment]B x 0.1)/(t1-t2) (1) The ten-point mean roughness (Rz) of TD of the other surface of the treated surface copper foil measured with a laser microscope in which the wavelength of the laser light is 405 nm is at least 0.35 [mu]m.
公开/授权文献:
- TWI574589B 表面處理銅箔、覆銅積層板、印刷配線板、電子機器及印刷配線板之製造方法 公开/授权日：2017-03-11
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |