基本信息:
- 专利标题： 電子零件及其製造方法
- 专利标题（英）：Electronic component and manufacturing method thereof
- 专利标题（中）：电子零件及其制造方法
- 申请号：TW103108999 申请日：2014-03-13
- 公开(公告)号：TW201503178A 公开(公告)日：2015-01-16
- 发明人： 渡邊文男 , WATANABE, FUMIO , 石川直純 , ISHIKAWA, NAOZUMI , 神山浩 , KAMIYAMA, HIROSHI
- 申请人： TDK股份有限公司 , TDK CORPORATION
- 专利权人： TDK股份有限公司,TDK CORPORATION
- 当前专利权人： TDK股份有限公司,TDK CORPORATION
- 代理人： 賴經臣; 宿希成
- 优先权： 2013-052215 20130314
- 主分类号： H01F27/28
- IPC分类号： H01F27/28 ; H01F41/04
An electronic component includes a first conductor layer including a first conductor pattern P1, a first insulating layer covering the first conductor layer, a first opening h1 passing through the first insulting layer to expose top and side surfaces of the first conductor pattern P1 therethrough, and a second conductor layer formed on the first insulating layer and including a second conductor pattern P2 connected to the first conductor pattern P1 through the first opening h1. A first opening region which is a planar region inside the first opening h1 includes a first region in which the first conductor pattern P1 is formed and a second region in which the first conductor pattern P1 is not formed. The second conductor pattern P2 is embedded in both the first and second regions of the first opening h1.
公开/授权文献:
- TWI543210B 電子零件及其製造方法 公开/授权日：2016-07-21
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01F | 磁体；电感；变压器；磁性材料的选择 |
| ------H01F27/00 | 变压器或电感器的一般零部件 |
| --------H01F27/28 | .线圈；绕组；导电连接 |