基本信息:
- 专利标题: 拆板總成及其操作方法
- 专利标题(英):Plate separation assembly and operating method thereof
- 专利标题(中):拆板总成及其操作方法
- 申请号:TW101119818 申请日:2012-06-01
- 公开(公告)号:TW201352096A 公开(公告)日:2013-12-16
- 发明人: 何崇文 , HO, CHUNG W. , 呂世明 , LEU, SHU MING
- 申请人: 旭德科技股份有限公司 , SUBTRON TECHNOLOGY CO. LTD.
- 专利权人: 旭德科技股份有限公司,SUBTRON TECHNOLOGY CO. LTD.
- 当前专利权人: 旭德科技股份有限公司,SUBTRON TECHNOLOGY CO. LTD.
- 代理人: 詹銘文; 葉璟宗
- 主分类号: H05K3/00
- IPC分类号: H05K3/00
A plate separation assembly and an operating method thereof are used to disassemble a plurality of plates for a coreless process. The plate separation assembly includes a machine and a composite board consisting of the plurality of plates. The machine includes a frame, onto which a clam shell structure and a linkage mounted. The inner surfaces of the clam shell are perforated, leading into one air pump behind each surface. The plurality of plates are held together by separable interface layers. To disassembly, the composite board is placed in between the two clam shell surfaces. Turning on the air pumps will create a vacuum between each interface of the clam shell surface and the board surface. The linkage is used to open the clam shell by force which separates the plates.
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |