To provide a bonding ribbon connecting the lead between element pad and substrate of semiconductor in the same time at many places, which elevate the ultrasonic bonding property, high conductivity capacity and loop property. The ribbon is constructed by gold coating layer over copper core. wherein copper core is made of copper having Vickers hardness lesser than 70 and purity greater than 99.9%, to get conductivity and loop formability for bonding ribbon; To form the fine microcrystal by using magnetron sputter to deposit said gold coating over the copper core tape at room temperature. Allow the Vickers hardness of said fine microcrystal be the same as that of core and coating layer to prevent the damage of Al pad, and also elevate the bonding property. The hardness of gold fine micricrysyal that is deposited under the rare gas atmosphere by magnetron sputter is greater than that of gold bulk, gold fine microcrystal is in the granule state, which can decline the thermal diffusion in bonding.