发明专利
TW201210742A 化學機械研磨中研磨速率校正的反饋 FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLISHING
审中-公开
基本信息:
- 专利标题： 化學機械研磨中研磨速率校正的反饋 FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLISHING
- 专利标题（英）：Feedback for polishing rate correction in chemical mechanical polishing
- 专利标题（中）：化学机械研磨中研磨速率校正的反馈 FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLISHING
- 申请号：TW100116191 申请日：2011-05-09
- 公开(公告)号：TW201210742A 公开(公告)日：2012-03-16
- 发明人： 錢隽 , 蓋瑞森查爾斯C , 迪漢達潘尼席維庫瑪 , 大衛傑弗瑞杜魯 , 李哈利Q
- 申请人： 應用材料股份有限公司
- 申请人地址： APPLIED MATERIALS, INC. 美國 US
- 专利权人： 應用材料股份有限公司
- 当前专利权人： 應用材料股份有限公司
- 当前专利权人地址： APPLIED MATERIALS, INC. 美國 US
- 代理人： 蔡坤財; 李世章
- 优先权： 美國 12/781,644 20100517
- 主分类号： B24B
- IPC分类号： B24B
A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.
公开/授权文献:
- TWI593513B 用於化學機械研磨中研磨速率校正的反饋的方法 公开/授权日：2017-08-01