发明专利
TW201134670A 預浸體、疊層板、貼金屬箔疊層板、電路基板及搭載ＬＥＤ用電路基板 PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR INSTALLING LED
有权
基本信息:
- 专利标题： 預浸體、疊層板、貼金屬箔疊層板、電路基板及搭載ＬＥＤ用電路基板 PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR INSTALLING LED
- 专利标题（英）：Prepreg, laminate, metal foil-clad laminate, circuit board, and circuit board for installing LED
- 专利标题（中）：预浸体、叠层板、贴金属箔叠层板、电路基板及搭载ＬＥＤ用电路基板 PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR INSTALLING LED
- 申请号：TW099137215 申请日：2010-10-29
- 公开(公告)号：TW201134670A 公开(公告)日：2011-10-16
- 发明人： 松田隆史 , 古森清孝 , 野末明義 , 鈴江隆之 , 西野充修 , 朝日俊行 , 北川祥與 , 谷直幸
- 申请人： 松下電工股份有限公司 , 松下電器產業股份有限公司
- 申请人地址： PANASONIC ELECTRIC WORKS CO., LTD. 日本 JP; PANASONIC CORPORATION 日本 JP
- 专利权人： 松下電工股份有限公司,松下電器產業股份有限公司
- 当前专利权人： 松下電工股份有限公司,松下電器產業股份有限公司
- 当前专利权人地址： PANASONIC ELECTRIC WORKS CO., LTD. 日本 JP; PANASONIC CORPORATION 日本 JP
- 代理人： 周良謀; 周良吉
- 优先权： 日本 2009-265440 20091120
- 主分类号： B32B
- IPC分类号： B32B ; C08J ; C08K ; H01L ; H05K
This invention provides a prepreg obtained by impregnating a woven textile with thermosetting resin composition. The thermosetting resin composition includes 80 to 200 parts by volume of inorganic filler relative to 100 parts by volume of thermosetting resin. The inorganic filler includes aluminum hydroxide of gibbsite type (A) having an average particle size (D50) of 2 to 15 &mgr; m, and at least one inorganic component (B) selected from the group consisting of boehmite particles having an average particle size (D50) of 2 to 15 &mgr; m, and inorganic particles having an average particle size (D50) of 2 to 15 &mgr; m and an ionization starting temperature over 400 DEG C, and containing crystal water or not, and alumina particles (C) having an average particle size (D50) under 1.5 &mgr m. The compounding ratio (volume ratio) among the aluminum hydroxide of gibbsite type (A), the at least one inorganic component (B) selected from the group consisting of boehmite particles and the inorganic particles, and the alumina particles (C) is 1: 0.1 to 2.5: 0.1 to 1.
公开/授权文献:
- TWI457241B 預浸體、疊層板、貼金屬箔疊層板、電路基板及搭載ＬＥＤ用電路基板 公开/授权日：2014-10-21