A probe card which can be used for testing narrow-pitched chips or multi-chips, and causes no faulty connections between probes and pads or between probes and a circuit board even in a high temperature environment such as in a burn-in test is provided. For this purpose, probe units in which multiple film probes are supported by support rods in a stacked or parallel-arranged manner are placed and fixed in each of the openings in a grid support. A plurality of fixing devices protruding from the grid support at a side to be connected to the circuit board are provided to be inserted in corresponding holes in the circuit board to fix the grid support to the circuit board.; There is no or subtle difference between an outer diameter of an inserting section of the fixing device and an inner diameter of the hole in the circuit board around the center of the circuit board with the inserting section inserted in the hole, and the difference is larger at the rest of the area of the circuit board.