发明专利
TW200835569A 利用雷射形成金屬薄膜的裝置及方法 APPARATUS AND METHOD FOR FORMING THIN METAL FILM USING LASER
审中-公开
基本信息:
- 专利标题： 利用雷射形成金屬薄膜的裝置及方法 APPARATUS AND METHOD FOR FORMING THIN METAL FILM USING LASER
- 专利标题（英）：Apparatus and method for forming thin metal film using laser
- 专利标题（中）：利用激光形成金属薄膜的设备及方法 APPARATUS AND METHOD FOR FORMING THIN METAL FILM USING LASER
- 申请号：TW096149820 申请日：2007-12-25
- 公开(公告)号：TW200835569A 公开(公告)日：2008-09-01
- 发明人： 金一鎬 KIM, IL HO
- 申请人： 寇溫DST股份有限公司 COWIN DST CO., LTD. , 金一鎬 KIM, IL HO
- 申请人地址： 韓國 韓國
- 专利权人： 寇溫DST股份有限公司 COWIN DST CO., LTD.,金一鎬 KIM, IL HO
- 当前专利权人： 寇溫DST股份有限公司 COWIN DST CO., LTD.,金一鎬 KIM, IL HO
- 当前专利权人地址： 韓國 韓國
- 代理人： 桂齊恆; 閻啓泰
- 优先权： 韓國 10-2006-0133628 20061226
- 主分类号： B23K
- IPC分类号： B23K ; G02F
The present invention relates to an apparatus and method for forming a thin metal film, in which holes are formed in an upper insulating layer using a laser and a thin metal film is formed between the holes when the metal pattern of a liquid crystal display is open, thus connecting disconnected portions of the open metal pattern. The thin metal film formation method connects disconnected portions of an open metal pattern when a metal pattern (41) deposited on a substrate is open. An insulating layer on the metal pattern is eliminated by radiating first laser light, and first and second contact holes (44), on which a thin film can be deposited, are formed in the metal pattern. The contact holes are filled with a thin metal film (46) by radiating second laser light. A thin metal film is formed between the holes by radiating second laser light.
公开/授权文献:
- TWI438049B 利用雷射形成金屬薄膜的裝置及方法 公开/授权日：2014-05-21
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |