基本信息:
- 专利标题： 黏貼片
- 专利标题（英）：Pressure-sensitive adhesive sheet
- 专利标题（中）：黏贴片
- 申请号：TW095119163 申请日：2006-05-30
- 公开(公告)号：TW200704742A 公开(公告)日：2007-02-01
- 发明人： 加藤揮一郎 KIICHIRO KATOH , 富能忠寬 TADAHIRO TOMINO , 鈴木智美 TOMOMI SUZUKI
- 申请人： 林鐵克股份有限公司 LINTEC CORPORATION
- 申请人地址： 日本
- 专利权人： 林鐵克股份有限公司 LINTEC CORPORATION
- 当前专利权人： 林鐵克股份有限公司 LINTEC CORPORATION
- 当前专利权人地址： 日本
- 代理人： 洪澄文
- 优先权： 日本 2005-210465 20050720 日本 2006-101385 20060403
- 主分类号： C09J
- IPC分类号： C09J
In a pressure-sensitive adhesive sheet 1 that comprises a base material 11 and a pressure-sensitive adhesive layer 12, and has formed therein by thermal processing a plurality of through holes 2 passing through one surface to the other surface of the pressure-sensitive adhesive sheet 1, as the base material 11, one is used for which, upon heating at a heating rate of 20° C/min under a nitrogen atmosphere, the temperature at a thermal decomposition peak where the mass reduction is greatest is not more than 450° C, or the difference between the temperature at the thermal decomposition peak and the temperature at a melting peak is not more than 250° C. According to this pressure-sensitive adhesive sheet 1, the appearance of the pressure-sensitive adhesive sheet 1 is not marred by the through holes 2 formed by the thermal processing.