The present invention is to provide a light emitting module which is simply composed, and which does not cause too large thickness and size, so as to make heat dissipation of light emitting components good. A pair of lands 33, 34 which are in respect to a surface of a wiring substrate 24, are respectively connected to two wiring circuit 35, 36. An assembly side outer electrode 30 of the Light emitting component 23 is connected to a lead frame which is used to mount a chip, on the contrary, a non-assembly side outer electrode 31 is connected the lead frame of the light emitting component through wiring bonding. And then the assembly side outer electrode 30 is connected to connected to the land 33 through soft solder paste 37, the non-assembly side outer electrode 31 is connected the land 34 through soft solder paste 37, an assembly light emitting component 23 is arranged on the wiring substrate 24. Width of a wiring circuit 35 which is soft soldered with the light emitting component 23, is wider than that of the wiring circuit 36 which is soft soldered with the non-assembly side outer electrode 31.