基本信息:
- 专利标题： BtoB 커넥터 핀의 부분도금방법
- 专利标题（英）：BtoB PARTIAL PLATING METHOD OF BtoB CONNECTOR PIN
- 申请号：KR1020180135274 申请日：2018-11-06
- 公开(公告)号：KR102245171B1 公开(公告)日：2021-04-27
- 发明人： 박용복
- 申请人： 대성하이피(주)
- 申请人地址： 경기도 안산시 단원구...
- 专利权人： 대성하이피(주)
- 当前专利权人： 대성하이피(주)
- 当前专利权人地址： 경기도 안산시 단원구...
- 代理人： 윤의섭; 김수진
- 主分类号： C25D5/12
- IPC分类号： C25D5/12 ; C25D5/02 ; C25D5/48 ; C25D7/00 ; C23F4/00 ; H01R13/03
The present disclosure relates to a method for plating a connector pin installed on a BtoB connector, and more specifically, to a partial plating method for plating only a part of a connector pin rather than plating the entire connector pin. According to one embodiment of the present disclosure, the partial plating method for plating the BtoB connector pin includes a nickel plating step of plating a BtoB connector pin with nickel, a first gold plating step of plating first and second contact areas where the connector pin is coupled with a BtoB connector with gold through a partial spray plating process after the nickel plating, and a second gold plating step of plating a terminal area where the connector pin is mounted on a board with gold.
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C25 | 电解或电泳工艺；其所用设备 |
| ----C25D | 覆层的电解或电泳生产工艺方法；电铸；工件的电解法接合；所用的装置 |
| ------C25D5/00 | 以工艺方法为特征的电镀；工件的预处理或后处理 |
| --------C25D5/10 | .一层以上相同金属或不同金属的电镀 |
| ----------C25D5/12 | ..至少有一层为镍或铬 |