基本信息:
- 专利标题： 도포성을 향상시킨 페이스트 휠
- 专利标题（英）：KR102230867B1 - paste wheel with improved applicability
- 申请号：KR1020200074263 申请日：2020-06-18
- 公开(公告)号：KR102230867B1 公开(公告)日：2021-03-23
- 发明人： 문혁준
- 申请人： (주)넥셈
- 申请人地址： 경상남도 창원시 성산구...
- 专利权人： (주)넥셈
- 当前专利权人： (주)넥셈
- 当前专利权人地址： 경상남도 창원시 성산구...
- 代理人： 정주석
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; C25D17/00 ; C25D5/00 ; C25D7/12 ; H01L21/48 ; B05C1/02
摘要：
본발명은어레이칩의외부에전극을도포하기위해사용되는페이스트휠에관한것으로서, 보다상세하게는도포장치의회전축에의해회전되는회전판외부에컴파운드가고정결합되되, 상기컴파운드는중심부의두께가가장자리의두께보다두꺼워서컴파운드의탄성변형량을증대시켜도포액이충진되는슬롯에서칩에도포할때 도포액의배출을원활하게가져갈수 있는도포성을향상시킨페이스트휠이다.
摘要（英）：
The present invention relates to a paste wheel used to apply an electrode to the outside of an array chip, and more particularly, a compound is fixedly coupled to the outside of a rotating plate rotated by a rotating shaft of an application device, and the thickness of the compound is at the edge. It is a paste wheel with improved applicability that can smoothly discharge the coating liquid when it is applied to the chip from the slot filled with the coating liquid by increasing the amount of elastic deformation of the compound because it is thicker than the thickness of.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |