基本信息:
- 专利标题: 가공 장치
- 专利标题(英):PROCESSING APPARATUS
- 申请号:KR20200068155 申请日:2020-06-05
- 公开(公告)号:KR20200144478A 公开(公告)日:2020-12-29
- 发明人: HASHIMOTO HIROYUKI , YASUDA SHINYA , TAKAHASHI SATOSHI
- 申请人: DISCO CORP
- 专利权人: DISCO CORP
- 当前专利权人: DISCO CORP
- 优先权: JP2019113104 2019-06-18
- 主分类号: B28D5/00
- IPC分类号: B28D5/00 ; B28D1/24
A processing apparatus includes a processing unit, a control unit, and a temperature detecting unit. The processing unit includes a cutting blade and a spindle assembly, the spindle assembly including a spindle having the cutting blade mounted on a distal end of the spindle and a spindle housing through which the spindle is inserted. A cooling fluid passage is formed in the spindle housing, the cooling fluid passage cooling the spindle assembly, and having one end connected to a cooling fluid supply source and having another end communicating with a cooling fluid outlet of the spindle housing. The temperature detecting unit detects the temperature of the spindle housing. The control unit determines whether a state of cooling of the spindle assembly is normal or abnormal on the basis of the temperature detected by the temperature detecting unit.
信息查询:
EspacenetIPC结构图谱:
B | 作业;运输 |
--B28 | 加工水泥、黏土或石料 |
----B28D | 加工石头或类似石头的材料 |
------B28D5/00 | 宝石、宝石饰物、结晶体的精细加工,例如半导体材料的精加工;所用设备 |