基本信息:
- 专利标题： 금속 필름들의 증착
- 申请号：KR20207034955 申请日：2019-05-02
- 公开(公告)号：KR20200141522A 公开(公告)日：2020-12-18
- 发明人： LEI YU , LEE SANG HYEOB , PABELICO CHRIS , XU YI , HA TAE HONG , TANG XIANMIN , PARK JIN HEE
- 申请人： APPLIED MATERIALS INC
- 专利权人： APPLIED MATERIALS INC
- 当前专利权人： APPLIED MATERIALS INC
- 优先权： US201862667120 2018-05-04
- 主分类号： C23C16/04
- IPC分类号： C23C16/04 ; C23C16/06 ; C23C16/14 ; C23C16/448 ; C23C16/455 ; C23C16/56 ; C23C28/00 ; H01L21/285 ; H01L21/768
摘要：
금속필름들을갖는전자디바이스들을제공하기위한장치들및 방법들이제공된다. 본개시내용의일부실시예들은코발트를포함하는금속필름으로충전되는라이너로서금속성텅스텐층을활용한다. 금속성텅스텐층은코발트에대한우수한접착력을가져서, 향상된코발트갭-필성능으로이어진다.
摘要（英）：
Apparatuses and methods to provide electronic devices having metal films are provided. Some embodiments of the disclosure utilize a metallic tungsten layer as a liner that is filled with a metal film comprising cobalt. The metallic tungsten layer has good adhesion to the cobalt leading to enhanced cobalt gap-fill performance.