基本信息:
- 专利标题: 금속 기판 및 그의 제조방법
- 专利标题(英):Metal substrate and method of manufacturing the same
- 专利标题(中):金属基板及其制造方法
- 申请号:KR1020140155217 申请日:2014-11-10
- 公开(公告)号:KR1020150105178A 公开(公告)日:2015-09-16
- 发明人: 이홍정
- 申请人: 아조텍 컴퍼니 리미티드
- 申请人地址: No.**-*, Kung-yeh *st RD, Kuan-Yin Industrial Park, Kuan-Yin Hsiang Taoyuan Hsien, Taiwan, R.O.C.
- 专利权人: 아조텍 컴퍼니 리미티드
- 当前专利权人: 아조텍 컴퍼니 리미티드
- 当前专利权人地址: No.**-*, Kung-yeh *st RD, Kuan-Yin Industrial Park, Kuan-Yin Hsiang Taoyuan Hsien, Taiwan, R.O.C.
- 代理人: 특허법인빛과소금; 특허법인태동
- 优先权: TW103107987 2014-03-07
- 主分类号: H05K3/46
- IPC分类号: H05K3/46 ; H05K1/03
Metal substrate includes a first insulation substrate, a second insulating substrate, a first metal layer and second metal layers. A first insulation substrate has a second surface opposite to the side surface and the first modification of the first modification. The first metal layer is directed toward the second surface. The insulation 2 is an insulating substrate 1 so as to be positioned between the second insulating substrate and the first metal substrate is bonded on the first surface modification. The second metal layer is an insulating substrate 2 so as to be positioned between the first modified surface and the second metal layer is disposed on one surface of the second insulating substrate. First characteristic surface roughness of the modified surfaces, the first surface modification is has a substantially smaller amount of change than 10% after separated from the second insulating substrate.
公开/授权文献:
- KR101721425B1 금속 기판 및 그의 제조방법 公开/授权日:2017-03-31
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |
--------H05K3/46 | .多层电路的制造 |