基本信息:
- 专利标题： 와핑된 실리콘 웨이퍼 흡착 장치 및 흡착 방법
- 专利标题（英）：Warped silicon-chip adsorption device and adsorption method thereof
- 专利标题（中）：加热硅胶吸附装置及其吸附方法
- 申请号：KR1020157020394 申请日：2013-12-26
- 公开(公告)号：KR1020150103153A 公开(公告)日：2015-09-09
- 发明人： 왕신신 , 장쉬추 , 쉬타오 , 주원징 , 쑨팡슝 , 쑨쥔
- 申请人： 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드
- 申请人地址： **** Zhangdong Road, Zhangjiang Hi-Tech Park, Shanghai ****** CHINA
- 专利权人： 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드
- 当前专利权人： 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드
- 当前专利权人地址： **** Zhangdong Road, Zhangjiang Hi-Tech Park, Shanghai ****** CHINA
- 代理人： 유성원; 배경용; 전소정
- 优先权： CN2012105868172 2012-12-28
- 国际申请： PCT/CN2013/090565 2013-12-26
- 国际公布： WO2014101795 2014-07-03
- 主分类号： H01L21/027
- IPC分类号： H01L21/027 ; H01L21/683 ; G03F7/20 ; H01L21/67
As Warping (warped) of the silicon wafer suction device and a suction method, the apparatus comprising: a chuck for adsorbing vacuum a silicon wafer; has the (chuck 100) and at least three suction head assembly 200, the chuck 100 cylinder 230 includes at least three apertures 101, each aperture 101 corresponds to one of the suction head assembly 200, connected fixed to each suction head assembly 200 includes a chuck 100, wherein, and a nozzle 210 connected to the active to the cylinder 230, the nozzle 210 is located, or at least a portion in all of the opening 101 under the driving of the cylinder 230 located on the surface of the upper portion of the chuck (100) . By an increase of at least three suction head assembly 200 on the chuck 100, the lower surface and the upper surface of the chuck 100 of the silicon wafer 300 is warped by the warped silicon wafer 300 is to be bonded the adsorption of the silicon wafer 300 is warped can be adsorbed, and extends to the suction head assembly 200 is completed by the time.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |