In accordance with the present invention and then in the production of semiconductor packages, formed in a semiconductor substrate portion through to be mounted to the semiconductor chip, the die through, and a plurality of semiconductor chips die bonded to a chip die during a flip-chip method to the other chip die, and by the rest of the chip to be mounted through the through one of the plurality of bonding the semiconductor chip manufacturing a semiconductor die package in a manner that the wiring connected to the semiconductor substrate it is possible to more simplify the process of the stacked-layer type semiconductor package. In addition, the heat generated from the semiconductor chip die penetration can be more easily released through the by preparing a package by mounting a flip chip scheme semiconductor chip located on the lower surface of the bonded plurality of semiconductor chip die to the die at the portion on a semiconductor substrate through by making it possible to improve the heat radiating effect.