基本信息:
- 专利标题： 열압축 본딩 중에 다수의 반도체 디바이스들을 유지하기 위한 디바이스 및 본딩 방법
- 专利标题（英）：Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding
- 专利标题（中）：用于在热电偶接合期间保持多个半导体器件的装置和接合方法
- 申请号：KR1020140095649 申请日：2014-07-28
- 公开(公告)号：KR1020150014395A 公开(公告)日：2015-02-06
- 发明人： 찬만청 , 판춘허
- 申请人： 에이에스엠 테크놀러지 싱가포르 피티이 엘티디
- 申请人地址： * YISHUN AVENUE * SINGAPORE ****** SINGAPORE
- 专利权人： 에이에스엠 테크놀러지 싱가포르 피티이 엘티디
- 当前专利权人： 에이에스엠 테크놀러지 싱가포르 피티이 엘티디
- 当前专利权人地址： * YISHUN AVENUE * SINGAPORE ****** SINGAPORE
- 代理人： 장훈
- 优先权： US13/953,152 2013-07-29
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/683 ; H01L23/00
A device for holding a plurality of semiconductor devices during the thermocompression bonding, the body; As a plurality of support surfaces on the first side of the body, each of the support surface is configured to maintain the at least one column of a semiconductor device during a compression bonding, if a plurality of support; And as a plurality of the inner conduits in the body, each of the inner conduit includes a plurality of internal conduits, which extend into the opening in the second side of the main body from the opening of each of the support surfaces of the support face in the first side of the main body the device is disclosed. In particular, the opening in the second side of the body are adapted to be connected to a separate pneumatic path to communicate that the fluid, each of the pneumatic paths is that the opening of the support surface on the first side of the main body in a first side of the body keeping optionally one or more semiconductor devices or for the supporting surface has a stand-controlled pneumatic suction force that to operate to release the semiconductor device therefrom. Through the device, and thermocompression bonding for holding the semiconductor device during the thermocompression bonding method for bonding a plurality of semiconductor devices on a substrate is also disclosed.
公开/授权文献:
- KR101674397B1 열압축 본딩 중에 다수의 반도체 디바이스들을 유지하기 위한 디바이스 및 본딩 방법 公开/授权日：2016-11-09
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |