基本信息:
- 专利标题: 정전방전에 강한 발광 다이오드 칩 및 그것을 갖는 발광 다이오드 패키지
- 专利标题(英):Led chip robust to esd and led package having the same
- 专利标题(中):LED芯片坚固耐用,并具有相同的LED封装
- 申请号:KR1020130077234 申请日:2013-07-02
- 公开(公告)号:KR1020150004139A 公开(公告)日:2015-01-12
- 发明人: 서덕일 , 김경완 , 윤여진 , 우상원
- 申请人: 서울바이오시스 주식회사
- 申请人地址: *B-**, **-**, Sandan-ro ***beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do, Republic of Korea
- 专利权人: 서울바이오시스 주식회사
- 当前专利权人: 서울바이오시스 주식회사
- 当前专利权人地址: *B-**, **-**, Sandan-ro ***beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do, Republic of Korea
- 代理人: 특허법인에이아이피
- 主分类号: H01L33/46
- IPC分类号: H01L33/46 ; H01L33/36 ; H01L33/62
A strong light-emitting diode chip and a light emitting diode package having it to the electrostatic discharge is provided. The light emitting diode chip comprising: a substrate; A light emitting diode portion disposed on the substrate; And the position on the substrate, the parallel portion is connected to the reverse light-emitting diode unit antiparallel diode; And a history of the reverse diode portion at least covering a part reflector. By arranging parts of the antiparallel diode with the LED unit in the LED chip, it is possible to provide a strong light emitting diode chip to an electrostatic discharge, and can also improve the light emission efficiency of the LED chip by disposing the reflector.
公开/授权文献:
- KR102091844B1 정전방전에 강한 발광 다이오드 칩 및 그것을 갖는 발광 다이오드 패키지 公开/授权日:2020-04-14