基本信息:
- 专利标题： 시스템-인-패키지 디바이스를 제조하는 방법 및 시스템-인-패키지 디바이스
- 专利标题（英）：A method of making a system-in-package device, and a system-in-package device
- 专利标题（中）：制造系统级封装设备的方法和系统级封装设备
- 申请号：KR1020147002380 申请日：2012-06-29
- 公开(公告)号：KR1020140088070A 公开(公告)日：2014-07-09
- 发明人： 쿠이스마헤이키 , 누루미사미
- 申请人： 무라타 일렉트로닉스 오와이
- 申请人地址： Myllynkivenkuja * FI-***** Vantaa, FINLAND
- 专利权人： 무라타 일렉트로닉스 오와이
- 当前专利权人： 무라타 일렉트로닉스 오와이
- 当前专利权人地址： Myllynkivenkuja * FI-***** Vantaa, FINLAND
- 代理人： 장훈
- 优先权： FI20115682 2011-06-30; FI20125595 2012-05-31
- 国际申请： PCT/FI2012/050693 2012-06-29
- 国际公布： WO2013001171 2013-01-03
- 主分类号： H01L25/04
- IPC分类号： H01L25/04 ; H01L25/16 ; B81C1/00
System-in-package device manufacturing method, and system-in-package device has been disclosed. In the method, at least one first species die, at least one second species die and a system having the predetermined dimensions having a predetermined dimension - at least one further component of the device system-in in-to a package device It is included. A first and a second at least one of the species selected for the die is piperidinyl jyeoning men and materials to form the at least one side is added to the added material and the selected die piperidinyl men jyeoning die structure of the selected die. The connecting layer is formed on the piperidinyl-Men jyeoning die structure. Piperidinyl men jyeoning the die structure is dimen jyeoning through the die and the connecting layer are not selected so as to mount the at least one additional component in contact with the die structure piperidinyl jyeoning men.
公开/授权文献:
- KR101881732B1 시스템-인-패키지 디바이스를 제조하는 방법 및 시스템-인-패키지 디바이스 公开/授权日：2018-07-27
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
| --------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件，例如整流二极管的组装件 |
| ----------H01L25/04 | ..不具有单独容器的器件 |