基本信息:
- 专利标题： 인쇄 회로 기판 및 그 제조 방법
- 专利标题（英）：Printed circuit board and method for manufacturing the same
- 专利标题（中）：印刷电路板及其制造方法
- 申请号：KR1020120155138 申请日：2012-12-27
- 公开(公告)号：KR1020140085023A 公开(公告)日：2014-07-07
- 发明人： 박용진 , 임성갑 , 유재범 , 고영관
- 申请人： 삼성전기주식회사 , 한국과학기술원
- 申请人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 专利权人： 삼성전기주식회사,한국과학기술원
- 当前专利权人： 삼성전기주식회사,한국과학기술원
- 当前专利权人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 代理人： 특허법인이지
- 主分类号： H05K3/38
- IPC分类号： H05K3/38 ; H05K3/46 ; H05K3/00
摘要：
Disclosed are a printed circuit board and a method for manufacturing the same. A printed circuit board, which includes a bonding layer interposed between an insulating layer on a substrate and a circuit layer; and a first metal layer formed between the bonding layer and the circuit layer, includes a polymer bonding layer, thereby increasing a bonding force between the circuit and the insulating layer which has low illuminance and is same as a resin, easily forming a fine circuit due to the low illuminance, and improving reliability with high bonding force and low signal transmission loss.
摘要（中）：
公开了一种印刷电路板及其制造方法。 一种印刷电路板，其包括插入在基板上的绝缘层和电路层之间的接合层; 并且形成在接合层和电路层之间的第一金属层包括聚合物接合层，从而增加电路和绝缘层之间的结合力，其具有低照度并且与树脂相同，容易形成精细电路 降低照度，提高可靠性，高粘接力和低信号传输损失。
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/38 | .绝缘基片和金属之间黏合的改进 |