基本信息:
- 专利标题： 칩 소자 및 그 제조 방법
- 专利标题（英）：Chip device and method for manufacturing the same
- 专利标题（中）：芯片装置及其制造方法
- 申请号：KR1020120107849 申请日：2012-09-27
- 公开(公告)号：KR1020140041022A 公开(公告)日：2014-04-04
- 发明人： 박정태 , 한승헌 , 최영준 , 문지희 , 김기원 , 곽준환
- 申请人： 삼성전기주식회사
- 申请人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 专利权人： 삼성전기주식회사
- 当前专利权人： 삼성전기주식회사
- 当前专利权人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 代理人： 특허법인씨엔에스
- 主分类号： H01G4/005
- IPC分类号： H01G4/005 ; H01G4/30
摘要：
The present invention relates to a chip device. The chip device according to an embodiment of the present invention comprises a laminate with a hexahedral shape, an external electrode which covers both ends of the laminate, and a shape maintaining material which is included in the external electrode and maintains the shape of the external electrode when the external electrode is formed.
摘要（中）：
芯片装置技术领域本发明涉及芯片装置。 根据本发明的实施例的芯片装置包括具有六面体形状的层压体，覆盖层压体的两端的外部电极和包含在外部电极中并保持外部电极的形状的形状保持材料 当外部电极形成时。