基本信息:
- 专利标题: 환경에 노출된 부분을 갖는 밀봉 MEMS 디바이스를 위한 공정
- 专利标题(英):Process for a sealed mems device with a portion exposed to the environment
- 专利标题(中):具有暴露于环境的部件的密封MEMS器件的工艺
- 申请号:KR1020147002250 申请日:2012-06-29
- 公开(公告)号:KR1020140033211A 公开(公告)日:2014-03-17
- 发明人: 데인맨,마이클,제이. , 림,마틴 , 시거,조셉 , 체르트코브,이고르 , 나시리,스티븐,에스.
- 申请人: 인벤센스, 인크.
- 申请人地址: **** Technology Drive San Jose CALIFORNIA *****, U.S.A.
- 专利权人: 인벤센스, 인크.
- 当前专利权人: 인벤센스, 인크.
- 当前专利权人地址: **** Technology Drive San Jose CALIFORNIA *****, U.S.A.
- 代理人: 허용록
- 优先权: US13/536,896 2012-06-28; US61/502,603 2011-06-29
- 国际申请: PCT/US2012/045061 2012-06-29
- 国际公布: WO2013003784 2013-01-03
- 主分类号: H01L21/50
- IPC分类号: H01L21/50 ; H01L29/84
A method and system for providing a MEMS device having a portion exposed to the outside environment is provided. The method comprises the step of forming the MEMS substrates by bonding a handle wafer to the device wafer with an insulating layer interposed between the handle wafer and the device wafer. Method by bonding the integrated circuit substrate comprising: at least one defined using the spacing portion of a lithographic system and at least one spaced-apart portions on the device wafer and forming a sealed cavity between the MEMS substrate and the indirect circuit board. Method includes defining at least one opening in the handle wafer, the separation unit, or an integrated circuit substrate, and a step of exposing a portion of a device wafer to the outside environment.
公开/授权文献:
- KR101718194B1 환경에 노출된 부분을 갖는 밀봉 MEMS 디바이스를 위한 공정 公开/授权日:2017-03-20
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |