基本信息:
- 专利标题： 반도체 패키지 및 그 제조 방법
- 专利标题（英）：Semiconductor package and manufacturing method thereof
- 专利标题（中）：半导体封装及其制造方法
- 申请号：KR1020120074947 申请日：2012-07-10
- 公开(公告)号：KR1020140008035A 公开(公告)日：2014-01-21
- 发明人： 정종대 , 이영우 , 방동현 , 조은나라
- 申请人： 앰코 테크놀로지 코리아 주식회사
- 申请人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 代理人： 제일특허법인
- 主分类号： H01L23/60
- IPC分类号： H01L23/60
摘要：
The present invention relates to a semiconductor package including a lid which protects a cavity region to which a semiconductor, active device, etc. such as an MEMS microphone are attached. According to the present invention, unlike a conventional method in which each metal lid is manually attached, a semiconductor package is manufactured by using a window made of plastic capable of being formed by injection molding as a lid which seals a cavity region to which a semiconductor chip and an active device are attached, attaching an N by N array of windows corresponding to an N by N array of packages, and dividing the semiconductor package into individual devices by performing a cutting process. Therefore, the process of assembling a semiconductor package can be simplified, and manufacturing costs can be significantly reduced.
摘要（中）：
本发明涉及一种半导体封装，其包括保护半导体，有源器件等诸如MEMS麦克风的空腔区域的盖。 根据本发明，与手动安装每个金属盖的常规方法不同，通过使用能够通过注射成型形成的塑料制成的窗口来制造半导体封装，该盖子密封了半导体 附接有与N×N个封装阵列相对应的N×N个窗口阵列，并且通过执行切割处理将半导体封装分割成各个器件。 因此，能够简化组装半导体封装的工序，能够显着降低制造成本。
公开/授权文献:
- KR101362398B1 반도체 패키지 및 그 제조 방법 公开/授权日：2014-02-13
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/552 | .防辐射保护装置，例如光 |
| ----------H01L23/60 | ..防静电荷或放电的保护装置，例如法拉第防护屏 |