基本信息:
- 专利标题： 반도체 패키지 및 그 제조 방법
- 专利标题（英）：Semiconductor package and manufacturing method thereof
- 专利标题（中）：半导体封装及其制造方法
- 申请号：KR1020120074947 申请日：2012-07-10
- 公开(公告)号：KR101362398B1 公开(公告)日：2014-02-13
- 发明人： 정종대 , 이영우 , 방동현 , 조은나라
- 申请人： 앰코 테크놀로지 코리아 주식회사
- 申请人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 代理人： 제일특허법인
- 主分类号： H01L23/60
- IPC分类号： H01L23/60
The present invention has been, according to the present invention, by hand having to adhere to the lid of a metal for this, a semiconductor package lead (cover) for protecting the cavity area in which the semiconductor chips, active elements such as MEMS microphones attached form the above-described conventional method and is of the N × N words, the semiconductor chip and the active which the device is attached to the lid for sealing the cavity area to the window of a plastic material that is injection moldable, the corresponding package element array of N × N and this is the by then bonding the window array through a method for separating a semiconductor package via a cutting process as a separate element manufacturing a semiconductor package, it is that not only can simplify the assembly process of the semiconductor package as well to reduce the production cost drastically.
公开/授权文献:
- KR1020140008035A 반도체 패키지 및 그 제조 방법 公开/授权日：2014-01-21
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/552 | .防辐射保护装置，例如光 |
| ----------H01L23/60 | ..防静电荷或放电的保护装置，例如法拉第防护屏 |