基本信息:
- 专利标题: 알루미늄 구조체의 제조 방법 및 알루미늄 구조체
- 专利标题(英):Method of manufacturing aluminum structure, and aluminum structure
- 专利标题(中):制造铝结构的方法和铝结构
- 申请号:KR1020127015024 申请日:2011-05-10
- 公开(公告)号:KR1020130069539A 公开(公告)日:2013-06-26
- 发明人: 호소에아키히사 , 닛타코지 , 오쿠노카즈키 , 아와즈토모유키 , 이나자와신지
- 申请人: 스미토모덴키고교가부시키가이샤
- 申请人地址: 일본 오사카후 오사카시 쥬오쿠 기타하마 *쵸메 *반**고
- 专利权人: 스미토모덴키고교가부시키가이샤
- 当前专利权人: 스미토모덴키고교가부시키가이샤
- 当前专利权人地址: 일본 오사카후 오사카시 쥬오쿠 기타하마 *쵸메 *반**고
- 代理人: 이철
- 优先权: JPJP-P-2010-110141 2010-05-12; JPJP-P-2010-110142 2010-05-12; JPJP-P-2010-122366 2010-05-28; JPJP-P-2010-130607 2010-06-08
- 国际申请: PCT/JP2011/060722 2011-05-10
- 国际公布: WO2011142338 2011-11-17
- 主分类号: C25D1/08
- IPC分类号: C25D1/08 ; C22C1/08 ; C23C14/20 ; C25D3/66
Conductive-lowering process, and the art conductive to form a conductive layer on the surface of the resin molded product of gold, silver, platinum, rhodium, ruthenium, palladium, nickel, copper, cobalt, at least one metal selected from the group consisting of iron and aluminum comprising a plating step of plating a molded article in a molten salt bath of aluminum in the localized resin, and even if the porous resin molded article having a three-dimensional mesh structure, a method capable to enable the plating of aluminum into the surface thereof to form an aluminum structure and, in particular, It provides a method for producing aluminum structures possible to obtain an aluminum porous body having a large area.