基本信息:
- 专利标题: 조화처리된 동박, 그 제조방법, 동박 적층판 및 인쇄회로기판
- 专利标题(英):Roughened copper foil, method for producing same, copper clad laminated board, and printed circuit board
- 专利标题(中):粗铜箔,其制造方法,铜包层压板和印刷电路板
- 申请号:KR1020127021811 申请日:2011-01-21
- 公开(公告)号:KR1020120123451A 公开(公告)日:2012-11-08
- 发明人: 우노,타케오 , 후지사와,사토시
- 申请人: 후루카와 덴키 고교 가부시키가이샤
- 申请人地址: *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, Japan
- 专利权人: 후루카와 덴키 고교 가부시키가이샤
- 当前专利权人: 후루카와 덴키 고교 가부시키가이샤
- 当前专利权人地址: *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, Japan
- 代理人: 장수길; 박충범
- 优先权: JPJP-P-2010-012086 2010-01-22
- 国际申请: PCT/JP2011/051132 2011-01-21
- 国际公布: WO2011090175 2011-07-28
- 主分类号: C22C19/00
- IPC分类号: C22C19/00 ; C22C19/03 ; B32B15/01 ; H05K3/38 ; H05K1/09 ; C25D7/06 ; C23C18/16
The present invention shows excellent characteristics in formation of a fine circuit pattern relates to having a good transmission characteristic excellent adhesion to the resin blend substrate treated copper foil and a method of manufacturing the same in a high frequency band. Conditioning the treated copper foil of the present invention is obtained by roughening at least one surface of the base copper foil (untreated copper foil) does not exceed 1.1㎛ to increase by 0.05 to 0.3㎛ with respect to the surface roughness (Rz) of the copper-based It has a roughened surface treated with a surface roughness (Rz) after the roughening treatment, where the roughened surface is from 0.3 to height and width of 0.4 to 1.8㎛ 0.8㎛ and 1.2 to 3.5, aspect ratio (height / width) of from which it is formed by the roughening particles of sharp tips protruding.
公开/授权文献:
- KR101830994B1 조화처리된 동박, 그 제조방법, 동박 적층판 및 인쇄회로기판 公开/授权日:2018-02-21
信息查询:
EspacenetIPC结构图谱:
C | 化学;冶金 |
--C22 | 冶金;黑色或有色金属合金;合金或有色金属的处理 |
----C22C | 合金(合金的处理入C21D、C22F) |
------C22C19/00 | 镍或钴基合金 |