基本信息:
- 专利标题： 구리 나노 페이스트 및 그 형성 방법, 그리고 상기 구리 나노 페이스트를 이용한 전극 형성 방법
- 专利标题（英）：Copper nano paste and method for forming the copper nano paste, and method for forming electrode using the copper nano paste
- 专利标题（中）：铜纳米粉末和形成铜纳米粉末的方法以及使用铜纳米粉末形成电极的方法
- 申请号：KR1020110017200 申请日：2011-02-25
- 公开(公告)号：KR1020120097778A 公开(公告)日：2012-09-05
- 发明人： 김동훈 , 오성일 , 강성구 , 전병호 , 송영아 , 김성진 , 전병진
- 申请人： 삼성전기주식회사
- 申请人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 专利权人： 삼성전기주식회사
- 当前专利权人： 삼성전기주식회사
- 当前专利权人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 代理人： 김창달
- 主分类号： H01B1/22
- IPC分类号： H01B1/22 ; H01L31/04
摘要：
PURPOSE: A copper nanopaste is provided to able to be treated in low temperatures under 200 °C, and to able to form an electrode for a silicon substrate, a polymer substrate, a glass substrate, a printed circuit board, etc which are unable to apply a high temperature process. CONSTITUTION: A copper nanopaste comprises 0.1-30 parts by weight of a binder, 10 parts by weight of additive, and 1-95 parts by weight of copper particle of which surface is coated with capping material, and has a particle size of 150 nm or less. A manufacturing method of the copper particle comprises: a step of forming a mixture solution by supplying a copper compound, a reducing agent, and solvent to a reactor; a step of forming a reaction composition comprising copper nano particles with a particle size of 150 nm or less, of which surface is coated with the capping material by adding a capping material into the mixture solution; and a step of obtaining copper nano particles from the reaction composition.
摘要（中）：
目的：提供能够在200℃以下的低温处理的铜纳米糊剂，并且能够形成用于硅基板，聚合物基板，玻璃基板，印刷电路板等的电极，其不能 应用高温工艺。 构成：铜纳米糊剂包含0.1-30重量份的粘合剂，10重量份的添加剂和1-95重量份的表面涂覆有覆盖材料的铜颗粒，并且具有150nm的粒径 或更少。 铜颗粒的制造方法包括：通过向反应器中供给铜化合物，还原剂和溶剂来形成混合溶液的步骤; 形成包含粒径为150nm以下的铜纳米粒子的反应组合物的步骤，通过向混合溶液中添加封盖材料，其表面被封盖材料涂布; 以及从反应组合物中获得铜纳米颗粒的步骤。
公开/授权文献:
- KR101273694B1 구리 나노 페이스트 및 그 형성 방법, 그리고 상기 구리 나노 페이스트를 이용한 전극 형성 방법 公开/授权日：2013-06-12
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01B | 电缆；导体；绝缘体；导电、绝缘或介电材料的选择 |
| ------H01B1/00 | 按导电材料特性区分的导体或导电物体；用作导体的材料选择 |
| --------H01B1/06 | .主要由其他非金属物质组成的 |
| ----------H01B1/22 | ..包含金属或合金的导电材料 |