基本信息:
- 专利标题： 전기도금 중 효율적인 물질 전달을 위한 유체역학적 전해질 제어
- 专利标题（英）：Control of electrolyte hydrodynamics for efecient mass transfer during electroplating
- 专利标题（中）：电解液中电解质水力转移控制
- 申请号：KR1020110066023 申请日：2011-07-04
- 公开(公告)号：KR1020120003405A 公开(公告)日：2012-01-10
- 发明人： 메이어,스티븐티. , 포터,데이빗더블유.
- 申请人： 노벨러스 시스템즈, 인코포레이티드
- 申请人地址： **** Cushing Parkway, Fremont, California ***** United States of America
- 专利权人： 노벨러스 시스템즈, 인코포레이티드
- 当前专利权人： 노벨러스 시스템즈, 인코포레이티드
- 当前专利权人地址： **** Cushing Parkway, Fremont, California ***** United States of America
- 代理人： 특허법인인벤투스
- 优先权： US61/361,333 2010-07-02; US61/374,911 2010-08-18; US61/405,608 2010-10-21
- 主分类号： C25D17/00
- IPC分类号： C25D17/00
摘要：
PURPOSE: A control of electrolyte hydrodynamics for efficient mass transfer during electroplating is provided to enable a user to utilize a damascene feature part, TSV characteristic part, and a wafer level packaging part for electroplating. CONSTITUTION: A control of electrolyte hydrodynamics for efficient mass transfer during electroplating comprises a plating chamber, a substrate holder, a flow shaping element and a flow diverter. The plating chamber comprises electrolyte and anode by electroplating in a flat substrate(105). The substrate holder holds the flat type substrate during electroplating so that the plating plant of substrate can be separated from anode. The specific-chimney channel can transfer electrolyte among electroplating through the flow fixed type element. The flow diverter locates in the surface facing to the substrate of the flow fixed type element.
摘要（中）：
目的：提供电镀过程中有效传质的电解质流体动力学控制，以使用户能够利用镶嵌特征部分，TSV特征部分和电镀用晶片级包装部件。 构成：用于在电镀期间有效传质的电解质流体动力学的控制包括电镀室，衬底保持器，流动成形元件和分流器。 电镀室包括通过电镀在平坦基板（105）中的电解质和阳极。 基板保持器在电镀期间保持扁平型基板，使得基板的电镀设备可以与阳极分离。 特定烟囱通道可以通过流动固定式元件在电镀之间转移电解质。 分流器位于面向流动固定式元件的基板的表面上。
公开/授权文献:
- KR101809751B1 전기도금 중 효율적인 물질 전달을 위한 유체역학적 전해질 제어 公开/授权日：2017-12-15
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C25 | 电解或电泳工艺；其所用设备 |
| ----C25D | 覆层的电解或电泳生产工艺方法；电铸；工件的电解法接合；所用的装置 |
| ------C25D17/00 | 电解镀覆用电解槽的结构件、或其组合件 |