The present invention relates to a multi-layer film structure of the organic electronic circuit and its production method. Multi-layer film body has a substrate layer, a first electrically conductive functional layer, electric semiconductor function layer, the insulating layer and the second electrically conductive functional layer. The organic electronic circuit has at least two portions. At least a portion of one of the two or more portions in the form of the interior of the interconnection assembly. At least one first part is repeated in the right direction into a plurality of configurations is formed separately inside the first electrically conductive functional layer, by the insulating layer in the first region of the central and separately covered with the first region of the central it is of the claim is not covered individually by an insulating layer within the second region disposed on both sides. At least one second portion of one of the two or more portions in the form of an electronic assembly. A first electrically conductive feature, at least one second portion of the inner layer are a plurality of configuration is repeated in the right direction. Such a configuration are arranged in a first region of the center is covered by an electrical semiconductor function layer and / or insulating layer. These arrangements are not covered by the at least one insulation layer inside the second region disposed adjacent to the portion. A second electrically conductive functional layer, a second electrically conductive functional layer, at least one portion in the form of the interior of the at least one configuration and the electronic assembly of the mutually continuous assembly at least a portion inside the first electrically conductive functional layer in the form of the interior of the It has a first zone, at least one of which covers the inside of the first at least one configuration of the electrically conductive functional layer in part, to form at least one electrically conductive connection. A second electrically conductive functional layer having a second area at least one of which provides an electrical component, first in the second zone, a second electrically conductive feature layer covers the at least one second part of the internal electronic assembly forms a part.