基本信息:
- 专利标题： 금속 베이스 회로 기판
- 专利标题（英）：Metal base circuit board
- 专利标题（中）：金属基座电路板
- 申请号：KR1020107028982 申请日：2009-05-21
- 公开(公告)号：KR1020110019754A 公开(公告)日：2011-02-28
- 发明人： 니시다이키 , 미야카와다케시 , 야마자키기요카즈 , 사이키다카시
- 申请人： 덴카 주식회사
- 申请人地址： *-*, Nihonbashi-Muromachi *-chome, Chuo-ku, Tokyo, Japan
- 专利权人： 덴카 주식회사
- 当前专利权人： 덴카 주식회사
- 当前专利权人地址： *-*, Nihonbashi-Muromachi *-chome, Chuo-ku, Tokyo, Japan
- 代理人： 특허법인태평양
- 优先权： JPJP-P-2008-140303 2008-05-29
- 国际申请： PCT/JP2009/059363 2009-05-21
- 国际公布： WO2009145109 2009-12-03
- 主分类号： H05K1/05
- IPC分类号： H05K1/05 ; H01L33/00 ; F21V29/00
It increases the lifetime of the LED, to improve the workability in circuit formation and during LED mounting of the printed wiring board. Coefficient of linear expansion of 60 ppm / ℃ more than 120 ppm / ℃ insulation layer and the insulation provided on one side of the layer, and the linear expansion coefficient of 10 ppm / ℃ more than 35 ppm / ℃ than the metal foil and made of a metal material, the insulating layer other side of the formed on a surface, and the linear expansion coefficient of 10 ppm / ℃ more than 35 ppm / ℃ or less circuit portion and non-circuit portion and the insulating layer, circuit portion and non-circuit has prevented a white formed on a portion, the insulating layer the non-circuit portion of the circuit and the total sum of the partial area of less than 50% to 95% with respect to the area of the metal foil, and a linear expansion coefficient of the relationship between the linear expansion coefficient of each material insulating layer> linear expansion coefficient of metal foil> circuit portion and non-circuit of linear expansion of the partial coefficient of metal It relates to the base circuit board.
公开/授权文献:
- KR101517649B1 금속 베이스 회로 기판 公开/授权日：2015-05-04
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/03 | ..基片材料的应用 |
| ------------H05K1/05 | ...绝缘的金属基片 |